<![CDATA[UOJ Online Search for 'se,phr:"Electronic packaging and interconnection series"']]>

<![CDATA[UOJ Online Search for 'se,phr:"Electronic packaging and interconnection series"']]> /cgi-bin/koha/opac-search.pl?q=ccl=se%2Cphr%3A%22Electronic%20packaging%20and%20interconnection%20series%22&format=rss2 2 0 50 Design guidelines for Surface mount and Fine pitch technology / ISBN 70595771 /cgi-bin/koha/opac-detail.pl?biblionumber=11473 By Solberg, Vern. New York McGraw-Hill 1996 . xvi, 261p. - , Includes index 70595771

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]]> /cgi-bin/koha/opac-detail.pl?biblionumber=11473 ELECTRONIC materials and processes handbook / ISBN 70542996 /cgi-bin/koha/opac-detail.pl?biblionumber=13473 New York McGraw-Hill 1994 . Varied pages- , Includes references & index. 70542996

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